? semiconductor components industries, llc, 2007 september, 2007 - rev. 0 1 publication order number: nup5150/d nup5150mu 5-line transient voltage suppressor array this 5-line transient voltage suppressor array is designed for applications requiring transient voltage protection capability. it is intended for use in over-transient voltage and esd sensitive equipment such as cell phones, portables, computers, printers and other applications. this device features a monolithic common anode design which protects five independent lines in a single udfn package. this device is ideal for situations where board space is at a premium. features ? protects up to 5 lines in a single udfn package ? esd rating of class 3b (exceeding 8 kv) per human body model ? compliance with iec 61000-4-2 ? this is a pb-free device applications ? hand held portable applications ? serial and parallel ports ? notebooks, desktops, servers maximum ratings (t j = 25 c, unless otherwise specified) symbol rating value unit t j operating junction temperature range -40 to 125 c t stg storage temperature range -55 to 150 c t l lead solder t emperature C maximum (10 seconds) 260 c esd human body model (hbm) iec 61000-4-2 contact (esd) 16000 8000 v stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. udfn6 case 517aa 5 = specific device code m = month code = pb-free package marking diagram http://onsemi.com device package shipping ? ordering information 1 2 3 6 5 4 pin assignment pin 1. cathode 2. anode 3. cathode 4. cathode 5. cathode 6. cathode udfn6 5-line transient voltage suppressor ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. NUP5150MUTBG udfn6 (pb-free) 3000/tape & reel 1 5 m *specific device code orientation may vary depending upon manufacturing location.
nup5150mu http://onsemi.com 2 electrical characteristics (t j = 25 c, unless otherwise specified) parameter conditions symbol min typ max unit reverse working voltage (note 1) v rwm - 5.0 v breakdown voltage i t = 1 ma, (note 2) v br 6.2 6.8 7.2 v reverse leakage current v rwm = 3 v i r - 0.1 a capacitance v r = 0 v, f = 1 mhz (line to gnd) c j - 12 15 pf 1. tvs devices are normally selected according to the working peak reverse voltage (v rwm ), which should be equal or greater than the dc or continuous peak operating voltage level. 2. v br is measured at pulse test current i t .
nup5150mu http://onsemi.com 3 0.001 0.01 0.1 1.0 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 1.0e-12 10e-12 100e-12 1.0e-9 10e-9 100e-9 123456 figure 1. capacitance figure 2. typical reverse current vs. reverse voltage reverse voltage (v) reverse current (a) t j = 25 c forward voltage (v) forward current (a) figure 3. typical forward current vs. forward voltage t j = 125 c t a = 25 c 14 12 10 8 6 4 2 0 01 2 3 6 bias voltage (v) t a = 25 c typical cap acitance (pf) 1 mhz frequency 45 t j = -40 c t j = 25 c t j = 125 c t a = 25 c t j = -40 c
nup5150mu http://onsemi.com 4 package dimensions udfn6, 1.2x1.0, 0.4p case 517aa-01 issue b notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 2x 0.10 c pin one reference top view 2x 0.10 c 10x a a1 (a3) 0.08 c 0.10 c c seating plane side view l2 1 3 4 6 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.127 ref b 0.15 0.25 d 1.20 bsc e 1.00 bsc e 0.40 bsc l 0.30 0.40 l2 0.40 0.50 mounting footprint* dimensions: millimeters 0.22 6x 0.42 6x 1.07 0.40 pitch *for additional information on our pb-free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. typical parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including typicals must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. nup5150/d publication ordering information n. american technical support : 800-282-9855 toll free ?usa/canada europe, middle east and africa technical support: ?phone: 421 33 790 2910 japan customer focus center ?phone: 81-3-5773-3850 literature fulfillment : ?literature distribution center for on semiconductor ?p.o. box 5163, denver, colorado 80217 usa ? phone : 303-675-2175 or 800-344-3860 toll free usa/canada ? fax : 303-675-2176 or 800-344-3867 toll free usa/canada ? email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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